Congratulations to Jihyun, Dongyun and Prof. Cho for receiving the “Outstanding Paper Award” at the Korean Society of Mechanical Engineers (대한기계학회) Thermal Engineering Division (열공학부문) spring conference, Jeju, Korea.

Prof. Cho gave an invited talk, titled "Thermoreflectance-Based Thermal Characterization for Semiconductor Devices and Packaging", at the the Korean Society of Mechanical Engineers (대한기계학회) Thermal Engineering Division (열공학부문) spring conference, held at Jeju, Korea, on April 22-25, 2026.

MHeat Lab attended the Korean Society of Mechanical Engineers (대한기계학회) Thermal Engineering Division (열공학부문) spring conference. (Jeju,...

Congratulations to Kyusung for receiving the “Outstanding Poster Presentation Award” at the Korean Microelectronics Packaging Society Conference (한국마이크로전자패키징학회) , Incheon, Korea .

MHeat Lab attended the Korean Microelectronics Packaging Society Conference (2026년 한국마이크로전자패키징학회 정기학술대회). (Incheon, Korea, April, 2026) Anisotropic Thermal Conductivity of CVD-grown h-BN Thin Films Measured by Frequency-Domain Thermoreflectance (Oral Presentation by Taeyeon Kim) Thermal Conductivity Measurements of Sub-Micron Sputtered AlN Films Using Frequency-Domain Thermoreflectance (Oral Presentation by Minkyu Je) Evaluating Thermal Bond Quality in 3D Advanced Packaging

Congratulations to Taeyeon for receiving the “Outstanding Presentation Award” at the 1st Korea Optoelectronics Society, KOES Winter Conference (한국광전자공학회) , Jeonju, Korea .

A new paper based on a recent work by Taeyeon, Hongju, Minkyu, Jihyun, and Prof. Cho is published in Acta Materialia (title: "Phonon thermal transport and cooling limits in submicron heteroepitaxial β-Ga2O3 films on SiC").

MHeat Lab attended the 33rd Korean Conference on Semiconductors (KCS 2026). (Gangwon, Korea, Jan. 2026) High Thermal Conductivity of Sub-100 nm BeO Thin Film (Oral Presentation by Jihyun Kim) Characterization of Thermal Transport Properties in NiO/Ga2O3 p-n Junction Diode (Oral Presentation by Taeyeon Kim) Thermal Management Solutions for GaN HEMTs through Electro-Thermal Modeling (Oral Presentation by Jisu Kim) Thermal Property Imaging for 3D Packaging Using Frequency-Domain

We had a group lunch and took group photos!