2026/04 : Conference (KMEPS 2026)
- 4월 3일
- 1분 분량
최종 수정일: 4월 6일
MHeat Lab attended the Korean Microelectronics Packaging Society Conference (2026년 한국마이크로전자패키징학회 정기학술대회). (Incheon, Korea, April, 2026)
Anisotropic Thermal Conductivity of CVD-grown h-BN Thin Films Measured by Frequency-Domain Thermoreflectance (Oral Presentation by Taeyeon Kim)
Thermal Conductivity Measurements of Sub-Micron Sputtered AlN Films Using Frequency-Domain Thermoreflectance (Oral Presentation by Minkyu Je)
Evaluating Thermal Bond Quality in 3D Advanced Packaging Using Frequency-Domain Thermoreflectance (FDTR) (Poster Presentation by Dongyun Seo)
Micron-Scale Thermal Property Characterization Using Thermo-Optic Phase Spectroscopy (TOPS) (Poster Presentation by Kyusung Han)
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