Journal Publications
__ (co)-corresponding authors
[31] Kim, J., Lee, S., Park, S., Baek, J., Seo, D., Choi, G., An, J., and Cho, J., "Simultaneous determination of the phase boundary thermal resistance and thermal conductivity in phase-separated TiO2 thin films", Acta Materialia (JCR top 3.9%), 277, p. 120165, 2024.
[30] Baek, J.,* Bae, J.,* Hori, T., and Cho, J., "Anisotropic and inhomogeneous thermal conductivity of sub-micrometer polycrystalline diamond thin films: A Monte Carlo ray tracing simulation study", International Communications in Heat and Mass Transfer (JCR top 4.4%), 156, p. 107683, 2024.
[29] Kim, K., Kong, D., Kim, Y., Jang, B., Cho, J., Kwon, H. J., and Lee, H., "Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap", Applied Thermal Engineering (JCR top 4.7%), 241, p. 122325, 2024.
[28] Park, S., Yang, B., Kim, J., Ko, J., Choi, G., An, J., and Cho, J., "Thermal conductivity of yttria-stabilized zirconia thin films grown by plasma-enhanced atomic layer deposition", Journal of the American Ceramic Society (JCR top 12.1%), 106(9), pp. 5454-5463, 2023.
[27] Kim, D., Choi, S., Cho, J., Lim, M., and Lee, B., "Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film", Physical Review Letters (JCR top 10.0%), 130, p. 176302, 2023.
[26] Kim, T.,* Song, C.,* Park, S., Lee, S., Lee, B., and Cho, J., "Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond", International Communications in Heat and Mass Transfer (JCR top 4.7%), 143, p. 106682, 2023.
[25] Kim, T.,* Park, S.,* Song, C., Lee, H., and Cho, J., "Fundamental conduction cooling limits for sub-1 µm Ga2O3 devices integrated with diamond", International Journal of Heat and Mass Transfer (JCR top 12.0%), 191, p. 122864, 2022.
[24] Kim, T., Kim, S., Kim, E., Kim, T., Cho, J., Song, C., and Baik, S., "High-Temperature Skin Softening Materials Overcoming the Trade-Off between Thermal Conductivity and Thermal Contact Resistance", Small (JCR top 6.6%), 17, p. 2102128, 2021.
[23] Lee, J., Jan, A. A., Ganorkar, S. P., Cho, J., Lee, D., and Baik, S., "Tunable solid-state thermal rectification by asymmetric nonlinear radiation", Materials Horizons (JCR top 8.3%), 8, pp. 1998–2005, 2021.
[22] Kim, J., Lee, S., Song, Y., Choi, S., An, J., and Cho, J., "Thermal conductivity of plasma-enhanced atomic layer deposited hafnium zirconium oxide dielectric thin films", Journal of the European Ceramic Society (JCR top 5.2%), 41(6), pp. 3397–3403, 2021.
[21] Kong, D., Kang, M., Kim, K. Y., Jang, J., Cho, J., In, J. B., and Lee, H., "Hierarchically Structured Laser-Induced Graphene for Enhanced Boiling on Flexible Substrates", ACS Applied Materials & Interfaces (JCR top 15.8%), 12(33), pp. 37784–37792, 2020.
[20] Song, C., Kim, J., and Cho, J., "The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices", International Journal of Heat and Mass Transfer (JCR top 12.0%), 158, p. 119992, 2020.
[19] Song, C., Kim, J., Lee. H., and Cho, J., "Fundamental limits for near-junction conduction cooling of high power GaN-on-diamond devices", Solid State Communications, 295, pp. 12-15, 2019.
[18] Kim, J. and Cho, J., "Low cross-plane thermal conductivity of sub-1 µm polycrystalline silicon thin films for thermoelectric applications", Energy Conversion and Management (JCR top 1.8%), 179(1), pp. 243-248, 2019.
[17] Kim, Y., Park, J., Shin, J., An, J., and Cho, J., "Thickness-dependent thermal conductivity of ultrathin (< 100 nm) barium titanate films", Ceramics International (JCR top 8.6%), 45(1), pp. 681-685, 2019.
[16] Cho, J., Park, J., Prinz, F. B., and An, J., "Thermal conductivity of ultrathin BaTiO3 films grown by plasma-assisted atomic layer deposition", Scripta Materialia (JCR top 10.8%), 154, pp. 225-229, 2018.
[15] Cho, J., "Thermal Properties of Anisotropic and/or Inhomogeneous Suspended Thin Films Assessed via Dual-Side Time-Domain Thermoreflectance: A Numerical Study", Nanoscale and Microscale Thermophysical Engineering (JCR top 14.1%), 22(1), pp. 6–20, 2018.
[14] Park, W., Kodama, T., Park, J., Cho, J., Sood, A., Barako, M. T., Asheghi, M., and Goodosn, K. E., "Thermal Conduction across Metal-Dielectric Sidewall Interfaces", ACS Applied Materials & Interfaces (JCR top 15.8%), 9(35), pp. 30100–30106, 2017.
[13] Park, W., Romano, G., Ahn, E. C., Kodama, T., Park, J., Barako, M. T., Sohn, J., Kim, S. J., Cho, J., Marconnet, A. M., Asheghi, M., Kolpak, A. M., and Goodosn, K. E., "Phonon Conduction in Silicon Nanobeam Labyrinths", Scientific Reports, 7, 2017.
[12] Cho, J., Park, J., and An, J., "Low thermal conductivity of atomic layer deposition yttria-stabilized zirconia (YSZ) thin films for thermal insulation applications", Journal of the European Ceramic Society (JCR top 5.2%), 37(9), pp. 3131–3136, 2017.
[11] Cho, J., Francis, D., Altman, D. H., Asheghi, M., and Goodson, K. E., "Phonon Conduction in GaN-Diamond Composite Substrates", Journal of Applied Physics, 121(5), p. 055105, 2017.
[10] Sood, A., Cho, J., Hobart, K. D., Feygelson, T. I., Pate, B. B., Asheghi, M., Cahill, D. G., and Goodson, K. E., "Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond", Journal of Applied Physics, 119(17), p. 175103, 2016.
[9] Cho, J., Li, Z., Asheghi, M., and Goodson, K. E., "Near-Junction Thermal Management: Thermal Conduction in Gallium Nitride Composite Substrates", Annual Review of Heat Transfer, 18, pp 7–45, 2015.
[8] Won, Y., Cho, J., Agonafer, D., Asheghi, M., and Goodson, K. E., "Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics", IEEE Transactions on Components, Packaging, and Manufacturing Technology, 5(6), pp. 737–744, 2015.
[7] Cho, J., Francis, D., Chao, P. C., Asheghi, M., and Goodson, K. E., "Cross-Plane Phonon Conduction in Polycrystalline Silicon Films", Journal of Heat Transfer, 137(7), p. 071303, 2015.
[6] Cho, J. and Goodson, K. E., "Thermal Transport: Cool Electronics", Nature Materials (JCR top 0.3%), 14(2), pp. 136–137, 2015.
[5] Cho, J., Li, Y., Hoke, W., Altman, D. H., Asheghi, M., and Goodson, K. E., "Phonon scattering in strained transition layers for GaN heteroepitaxy", Physical Review B, 89(11), p. 115301, 2014.
[4] Cho, J., Li, Z., Bozorg-Gayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., and Goodson, K. E., "Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications", IEEE Transactions on Components, Packaging, and Manufacturing Technology, 3(1), pp. 79-84, 2013.
[3] Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., and Goodson, K. E., "Low Thermal Resistances at GaN–SiC Interfaces for HEMT Technology", IEEE Electron Device Letters, 33(3), pp. 378–380, 2012.
[2] Pyun, S. H., Cho, J., Davidson, D. F., and Hanson, R. K., "Interference-free mid-IR laser absorption detection of methane", Measurement Science and Technology, 22(2), p. 025303, 2011.
[1] Cook, R. D., Pyun, S. H., Cho, J., Davidson, D. F., and Hanson, R. K., "Shock tube measurements of species time-histories in monomethyl hydrazine pyrolysis", Combustion and Flame, 158(4), pp. 790-795, 2011.
Conference Proceedings and Presentations
[15] Yates, L., Sood, A., Cheng, Z., Bougher, T., Malcolm, K., Cho, J., Asheghi, M., Goodson, K., Goorsky, M., Faili, F. and Twitchen, D.J., "Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices," IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2016, Oct. 23-26, Austin, TX, USA.
[14] Cho, J., Sood, A., Hayee, F., Asheghi, M., and Goodson, K. E., "Thermal Characterization of Nanocrystalline Diamond Films on Silicon", ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6-9, San Francisco, CA.
[13] Cho, J., Asheghi, M., and Goodson, K. E., "Phonon-Defect Scattering and Thermal Boundary Resistance for GaN Heteroepitaxy on SiC and Diamond", 2015 Materials Research Society (MRS) Spring Meeting, April 6-10, 2015, San Francisco, CA.
[12] Cho, J., Won, Y., Francis, D., Asheghi, M., and Goodson, K. E., "Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates", IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2014, Oct. 19-22, La Jolla, CA, USA.
[11] Tyhach, M., Altman, D., Bernstein, S., Korenstein, R., Cho, J., Goodson, K. E., Francis, D., Faili, F., Ejeckam, F., Kim, S., and Graham, S., "S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates", IEEE Lester Eastman Conference on High Performance Devices (LEC) 2014, Aug. 5-7, Ithaca, NY, USA.
[10] Cho, J., Chu, K. K., Chao, P. C., McGray, C., Asheghi, M., and Goodson, K. E., "Thermal Conduction Normal to Thin Silicon Nitride Films on Diamond and GaN", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27-30, Orlando, FL, USA.
[9] Sood, A., Cho, J., Hobart, K. D., Feygelson, T., Pate, B., Asheghi, M., Goodson, K. E., "Anisotropic and Nonhomogeneous Thermal Conduction in 1 µm Thick CVD Diamond", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27-30, Orlando, FL, USA.
[8] Sood, A., Eryilmaz, S. B., Jeyasingh, R., Cho, J., Asheghi, M., Wong, H. S. P., and Goodson, K. E., "Thermal Characterization of Nanostructured Superlattices of TiN/TaN: Applications as Electrodes in Phase Change Memory", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27-30, Orlando, FL, USA.
[7] Altman, D., Tyhach, M., McClymonds, J., Kim, S., Graham, S., Cho, J., Goodson, K. E., Francis, D., Faili, F., Ejeckam, F., and Bernstein, S., "Analysis and Characterization of Thermal Transport in GaN HEMTs on Diamond Substrates", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27-30, Orlando, FL, USA.
[6] Cho, J., Chao, P. C., Asheghi, M., and Goodson, K. E., "Phonon Conduction Normal to Polysilicon Films on Diamond," ASME 4th Micro/Nanoscale Heat & Mass Transfer (MNHMT) International Conference 2013, Dec. 11-14, Hong Kong, China.
[5] Won, Y.*, Cho, J.*, Agonafer, D., Asheghi, M., and Goodson, K. E., "Cooling Limits to GaN HEMT Technology," IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2013, Oct. 13-16, Monterey, CA, USA (* contributed equally).
[4] Cho, J., Li, Z., Asheghi, M., and Goodson, K. E., "Phonon-Defect Scattering and the Thermal Resistance of the Transition Layers for GaN Heteroepitaxy", 2013 Materials Research Society (MRS) Spring Meeting, April 1-5, 2013, San Francisco, CA.
[3] Cho, J., Li, Y., Altman, D. H., Hoke, W., Asheghi, M., and Goodson, K. E., "Temperature Dependent Thermal Resistances at GaN-Substrate Interfaces in GaN Composite Substrates", IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2012, Oct. 14-17, La Jolla, CA, USA.
[2] Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E., "Thermal Characterization of GaN-on-Diamond Substrates for HEMT Applications," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Diego, CA.
[1] Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Altman, D. H., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E., "Thermal Characterization of Composite GaN Substrates for HEMT Applications", Government Microcircuit Applications & Ctritical Technology (GomacTech) Conference 2012, March 18-20, Las Vegas, Nevada.