Heat transfer plays a central role in many applications, such as information processing and energy conversion technologies and the thermal management of electronics. Progress has been made over the past decades in understanding heat transfer processes across various length scales (nano, micro, meso and macro) and tackling various challenges associated with these processes. Our research interests lie at the intersection of understanding fundamental heat transfer processes at the nanoscale and providing engineering solutions to real-world heat transfer problems. Our research includes (but not limited to) the following areas: 

 

  1) Thermal property measurements for advanced semiconductor materials.

  2) Metrology & Inspection (MI) for Advanced Packaging

  3) Near-junction thermal management for high-power semiconductors.

  4) Electro-thermal co-modeling for high-power semiconductors.

  5) Optimal thermal property design for novel cooling architecture.

 

On a fundamental level, we propose to understand the underlying mechanisms of heat transport (energy carriers, scattering mechanisms, etc.) by using unique thermal property measurement and simulation methods. On a practical level, we aim to improve the design, performance, and reliability of electronic devices and energy conversion and transport systems through close collaboration with industry.