2023/10 : Conference

MHeat Lab attended the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2023 conference (San Diego, CA, U.S.A), and made presentations in technical and poster sessions.

• Thermal Conductivity Measurement of Gallium Nitride Thin Films Using Thermoreflectance (presented by Jihyun Kim)

• Thermal Management of GaN-on-Diamond HEMTs Through Electro-Thermal Modeling (presented by Changhwan Song)