2021/06 : New Paper
- jungwancho
- 2021년 6월 16일
- 1분 분량
최종 수정일: 2022년 4월 5일
A new paper for which Prof. Cho is a co-author is accepted in Small.
Title: High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

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