2020/10 : Conference
2020년 10월 7일
1분 분량
MHeat Lab attended the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2020 conference (Online), and made presentations in poster sessions.
Thermal Conductivity Measurement of Yttrium-Doped and Undoped Hafnium Zirconium Oxide Dielectrics Thin Films (presented by Jihyun Kim)
The Effect of GaN Epilayer Thickness on the Near-junction Thermal Resistance of GaN-on-diamond Devices (presented by Changhwan Song)
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